Article 15414

Title of the article



Litvinov Aleksandr Nikolaevich, Doctor of engineering science, professor, sub-department of theoretical and applied mechanics and graphics, Penza State University (40 Krasnaya street, Penza, Russia),
Khadi Odey Shaker, Postgraduate student, Penza State University (40 Krasnaya street, Penza, Russia),
Yurkov Nikolay Kondrat'evich, Doctor of engineering sciences, professor, head of sub-department of radio equipment design and production, Penza State University (40 Krasnaya street, Penza, Russia),

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Background. Mathematical modeling of the mode of deformation of the layered structures of radio-electronic means (REM) is a very important problem, which allows to identify at early design stages the most stressed structural elements of REM at technological and experimental impacts. The aim of the work is to increase the reliability and maintenance of tactical and technical characteristics of the product design and technological methods.
Materials and methods. The authors suggested a classification of the models describing the mode of deformation of the layered structures. Modeling of the structure of the layers was performed numerically using the developed software package.
Results. The researchers developed a complex of simulation programs and carried out a numerical analysis of the distribution of thermomechanical stress on the surface of the multilayer board with micro-thermal exposure. The authors determined the zones of optimal placement of tensoresistive elements on the surface of the board.
Conclusions. The numerical studies have shown that to ensure the stability of the metrological characteristics of laminated boards it is required to permanently control thickness of the adhesive joint, use a soft adhesives and select the optimal geometric dimensions of boards to ensure a more even distribution of thermomechanical stresses in the areas with tensoresistive elements.

Key words

mode of deformation, thermal influence, layered structure, board, electronic systems.

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Дата обновления: 03.03.2015 15:28